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 Ve311 Lab #2

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Ve311 Lab #2

Note:
(1) Please use A4 size papers.
(2) The lab report should be submitted online individually.
(3) Use Proteus 8.10 for simulation before the lab session. In the Proteus
library, you should be able to find all the components used in the schematics.
The lab report must include both the simulation and measurement
results.
1. [Common-Emitter Amplifier]
(a) [40%] Design and build a common-emitter amplifier in Proteus and
on the breadboard which has a voltage gain Aυ > 10, using npn BJT
2N3904. Plot VOUT vs VIN . (Hint: First choose an appropriate RC .
Second, perform DC sweep to find out a VIN at which the magnitude
of slope is more than 10. At the same time, make sure the BJT is in
the forward-active region. If not working, change for another RC and
repeat the DC sweep analysis again.)
(b) [30%] For Vin = VIN + 0.01sin(2π102
∙ time) , plot Vout = VOUT +
υout vs time. Confirm that the amplitude of υout is equal to 0.01 ×
Aυ.
(c) [30%] For Vin = VIN + 0.01sin(2π107
∙ time) , plot Vout = VOUT +
υout vs time. Is the amplitude of υout still equal to 0.01 × Aυ? If not,
explain the possible reasons.
2
© Semiconductor Components Industries, LLC, 2012
August, 2012 − Rev. 8
1 Publication Order Number:
2N3903/D
2N3903, 2N3904
General Purpose
Transistors
NPN Silicon
Features
• Pb−Free Packages are Available*
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector−Emitter Voltage VCEO 40 Vdc
Collector−Base Voltage VCBO 60 Vdc
Emitter−Base Voltage VEBO 6.0 Vdc
Collector Current − Continuous IC 200 mAdc
Total Device Dissipation
@ TA = 25°C
Derate above 25°C
PD
625
5.0
mW
mW/°C
Total Device Dissipation
@ TC = 25°C
Derate above 25°C
PD
1.5
12
W
mW/°C
Operating and Storage Junction
Temperature Range
TJ, Tstg −55 to +150 °C
THERMAL CHARACTERISTICS (Note 1)
Characteristic Symbol Max Unit
Thermal Resistance, Junction−to−Ambient RJA 200 °C/W
Thermal Resistance, Junction−to−Case RJC 83.3 °C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Indicates Data in addition to JEDEC Requirements.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
MARKING DIAGRAMS
http://onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
ORDERING INFORMATION
COLLECTOR
3
2
BASE
1
EMITTER
2N
390x
YWW

x = 3 or 4
Y = Year
WW = Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
1 2 3
1
2
BENT LEAD
TAPE & REEL
AMMO PACK
STRAIGHT LEAD
BULK PACK
3
TO−92
CASE 29
STYLE 1

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